Flex PCB Capabilities

Flex PCB Capabilities

Flex PCB Capabilities


Items

Standard

Advanced

Remarks

Number of Layers

0-4L

0-6L

For orders above 6 layers, please contact our sales rep.

Material

Polyimide

PET

For exampleDupont, shengyi, Taiflex, Iteq, etc.

Maximum PCB Size
(Dimension)

480*480mm

1200*480mm

Raw material width is only two types 250/500mm

penalization should be based on the above two sizes,

for any sizes beyond this dimension, please contact sales.

Board Size Tolerance
(Outline)

±0.10mm for punching

+/-0.05mm fo

r laser cutting

±0.05mm for laser routing, and ±0.1mm for Die punching.

Board Thickness

0.05-0.3mm

0.05-0.75mm

0.05-0.75mm. Please view the below "Standard PCB" or contact us if your board exceeds these.

Board Thickness
Tolerance

±0.05mm

±0.03mm

min±0.03mm

Normally “+ Tolerance” will occur due to PCB processing steps such as electroless copper, solder mask and other types of finish onthe surface.

Min Trace

3mil

1mil

Min manufacturable trace is 1mil(0.025mm), strongly suggest designing trace above 3mil(0.0.75mm) to save cost.

Min Spacing

3mil

1mil

Min manufacturable spacing is 1mil(0.025mm), strongly suggest designing spacing above 3mil(0.0.75mm) to save cost.

Outer Layer

Copper Thickness

1/3-2oz

1/3-3oz

Also known as copper weight. 35μm=1oz. Please view the below "Standard PCB" or contact us if you need copper weight greater than 3oz.

Inner Layer

Copper Thickness

1/3-2oz

1/3-3oz

Inner copper weight as per customer's request for 4 and 6 layers(Multi-layer laminated structure). Please contact us if you need copper weight greater than 3oz.

Drill Sizes (CNC)

0.2-6.0mm

0.1-6.5mm

Min drill size is 0.1mm, max drill is 6.5mm. Any holes greater than 6.5mm or smaller than 0.3mm will be subject to extra charges.

Min Width of

Annular Ring

0.15mm

0.1mm

For pads with vias in the middle, Min width for Annular Ring is 0.1mm(4mil).

Finished Hole

Diameter (CNC)

0.05-6.0mm

0.05-6.5mm

The finished hole diameter will be smaller than the size of the drill bits because of the copper plating in the hole barrels

Finished Hole Size

Tolerance(CNC)

+/-0.076mm

+/-0.05mm

min±0.05mm

For example, if the drill size is 0.6mm, the finished hole diameter ranges from 0.525mm to 0.675mm will be considered acceptable.

Solder Mask(type)

coverlay

LPI solder

mask ink

Liquid Photo-Imageable is mostly adopted.

Minimum Character

Width(Legend)

0.2mm

0.127mm

Characters of less than 0.127mm wide will be too narrow to be identifiable.

Minimum Character

Height (Legend)

0.8mm

0.71mm

Characters of less than 0.71mm high will be too small to be recognizable.

Character Width to

Height Ratio (Legend)

4:01

5.6:1

In PCB silkscreen legends processing, 1:5.6 is the most suitable  ratio

Minimum Diameter

of Plated Half Holes

0.5mm

 

Design Half-Holes greater than 0.5mm to ensure a better connection between boards.

Surface Finishing

Immersion Au (1-5u"),
OSP(0.12um minimum)
Immersion Tin(1um minimum)
Immersion Ag(0.12um minimum)
Hard gold (2-80u")
Flash gold(1-5u")
ENG+OSP etc.

 

The most popular two types of PCB surface finish. Immersion Au (1-5u"), OSP(0.12um minimum)

coverlay(color)

White, Black, yellow

 

 

Solder Mask(color)

White, Black, yellow
greenand matt color

 

 

Silkscreen(color)

White, Black, yellow

green,blue,grey,red,

purple

 

 

Panelization(type)

Tab-routing, Tab-routing with Perforation (Stamp Holes)

 

Leave min clearance of 1.0mm between boards for break-routing. For V-score penalization, set the space between boards to zero.

Others

Fly Probe Testing
A.O.I. E-testing

 

 

Qualification

UL Certified ISO9001

ISO13485/TS16949

Reach RoHS IPC PPAP IMDS

 


Overview


Flex PCB Manufacturing Process is a form of Printed Circuit Board (PCB) that is made of flexible, instead of rigid, material. This type of PCB is used for a variety of applications, such as medical and automotive, as it is capable of being bent or folded and is also lightweight. 


The process for Manufacturing Flex PCBs


The process for manufacturing flex PCBs involves making a design with a CAD program, followed by fabrication of the PCB, which is done by laminating thin layers of copper foil onto the flex material. The copper layers are then patterned with a photolithography process, where an etching mask is used to create the desired circuitry pattern. Then the copper layers are etched with a chemical or mechanical process to remove the unwanted copper, leaving the desired circuitry pattern. Finally, a solder mask is applied to the board and the components are soldered on to complete the board.


Advantages of Our Flex PCB Capabilities


  • 1. Advanced manufacturing techniques: Our flex PCB capabilities utilize the latest advanced manufacturing techniques to achieve better accuracy, reliability, and quality.

  • 2. Advanced testing methods: We employ rigorous quality assurance processes and advanced testing methods to ensure that our flex PCBs are of the highest quality.
  • 3. Design flexibility: Our flex PCBs are highly customizable and provide design flexibility to meet customer requirements.
  • 4. Cost-effectiveness: Our flex PCBs are cost-effective, providing savings in materials, labor, and overall production costs.
  • 5. Small size: Our flex PCBs are small in size, allowing them to fit into tight spaces and enabling them to be used in a variety of applications.
  • 6. Durability: Our flex PCBs are highly durable, providing resistance to vibrations, shocks, and electrical changes.
  • 7. High-speed performance: Our flex PCBs provide high-speed performance and can handle high data transfer rates.
  • 8. Reduced component count: Our flex PCBs require fewer components than standard PCBs, reducing overall assembly costs.

Single-layer Process


Double-layer Process


Multilayer Process


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