| Flex PCB Technical Specification |
| Layer | 1-12 layers |
| construction | Any layer |
| Board thickness | 0.10mm-3.2mm Min:( double layer: 0.10mm, 4-layers:0.26mm) |
| Tolerance of board thickness | ± 10% |
| Mechanical drilled hole size | Min: 0.1mm AR: 75mm Accuracy: 50um |
| Laser drilled hole size | Min: 0.05mm Accuracy: 0.025mm |
| Min.line width | Standard copper thickness:45um Heavy copper(3OZ) thickness: 150um |
| Min.line spaceing | Standard copper thickness:45um Heavy copper(3OZ) thickness: 150um |
| Surface finish/treatment | OSP/ENIG/ENEPIG/H.A.L(Forpoly imide ONLY) |
| Dimension Tolerance | Conductor Width(W): 0.03mm |
| Accumulated Pitch(P): 0.05mm |
| Outline Dimension(L): 0.05mm |
| Conductor(C): 0.075mm |
