PCB Assembly Material Part

       >     uBGA/QFN/QFP

       >     Lead  free  &Halogen  free 

               BGA ball diameter:0.12mm~

       >     No-clean solder paste

               BGA pitch:0.35mm～1.27mm

       >     Low  termperature  solder  paste  

               QFN/OFP fine pitch:0.35mm~

       >     Water   soluble   solder  paste 

       >     01005 chip component

       >     0dd component