| Aluminum PCB Process Capabilities | ||||
| Board Thickness | 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm, 2.0mm, 3.0mm. The selection of aluminum base mainly considers thermal expansion coefficient, thermal conductivity, strength, hardness, weight, processing conditions, and cost | |||
| Copper Thickness | 1oz, 2oz, 3oz–12oz | |||
| Minimum drilling hole | 0.65mm | |||
| Min & Max dimensions of finished boards | According to the requirements of single panel, 5 * 5 | |||
| Min trace width & space | 0.127/0.127mm (with a limit of 0.1/0.1mm). | |||
| Technical Requirement | AOI full test+flying needle sampling (free) | |||
| Solder Mask Colors | Green, White, Black | |||
| Characters Silkscreen | White, Black. | |||
| Surface Treatment: | HASL, HAL Leaded, ENIG, Golden plated | |||
| Shipping type | Single piece , panel V-CUT/gong edge (minimum gong slot width: 1.6mm), generally not recommended for stamp hole panel assembly (can also be made in special circumstances) | |||
| Product coverage | multiple fields such as automotive light panels, bubble lights/corn lights/street light panels, power boards, etc | |||
| Multiple options for sheet metal | 1-series aluminum, 3-series aluminum, 5-series aluminum, etc | |||
| Thermal conductivity coefficient | 1-8W | |||
| High thermal conductivity and fast conduction; Has good heat dissipation and stability | ||||
| Metal Core PCB Process Capabilities | ||||
| Item | parameter | note | ||
| Size | 630*1100mm.max | 520*450mm.max for copper base | ||
| Layer | 1L-6L | |||
| Thermal Conductivity | 1W/1.5W/2W/2.5W/3W/5W/8W/10W | thickness 76/100/120/150um | ||
| Board Thickness | 1-6L | 0.8/1.0/1.2/1.4/1.5/1.6/2.0/3.0mm | special thickness 4.0/5.0mm | |
| Board Thickness Tolerance | ±10% | |||
| Min. Hole Size | PTH | 0.2mm | ||
| NPTH | 1.0mm | |||
| Holes Size Tolerance | PTH | ±0.076mm | press-fit hole ±0.05MM；slot +/-0.1mm | |
| NPTH | ±0.05mm | |||
| Holes Position Tolerance | ±0.075mm | |||
| Min. circuit width/space | normal 0.1/0.1mm | advanced 0.075/0.075mm | 1OZ copper thickness | |
| Circuit Tolerance | ±10% | |||
| Copper thickness | surface copper thickness | 0.5-5OZ | ||
| copper on holes wall | 18-25um | |||
| Surface Finish/ SurfaceTreatment | ENIG | Au/Ni | 1-5U”/100-300U” | |
| Hard gold | Au/Ni | 0.4-0.8U”/100-300U” | gold finger 3-100U" | |
| immersion Ti | 0.8-1.2um | |||
| immersion silver | 0.15-0.5um | |||
| HASL | 1-40um | |||
| OSP | 0.12um | |||
| Soldermask | Thickness | 5-30um | ||
| Silkscreen | Height min./Width min. | 0.75mm/0.1mm | ||
| Profile | Tolerance | routing | ±0.10mm | |
| punching | ±0.10mm | |||
| V-CUT | angle | 20-60° | ||
| position tolerance | ±0.10mm | |||
| Min.punching hole | 0.6mm | |||
| Min.punching slot | 0.6mm | |||
| Min.routing slot | 0.8mm | |||
