| Rigid-Flex PCB Technical Specification |
| Layer | 1-8 layers |
| Finish Board Thickness | 0.25-6.0mm |
| Min Pattern Width / Spacing | 0.05mm/0.05mm |
| Max Finish Board Size | 230*450mm |
| Finish Board Thickness Tolerance | ±50.05mm |
| PP Thickness | 12.5um/25um/50um |
| Copper Thickness | 12um/18um/36um/70um |
| Stiffener Materail | FR4/PI/PET/SUS/PSA |
| Surface Treatment | ENIG/Immersion Tin/OSP/Immersion Silver/Plating Gold |
| Min Mechanical Dirlling Hole | 0.15mm |
| Min Laser Dirlling Hole | 0.1mm |
| Hole Tolerance | NPTH:±0.05mm PTH:±0.075mm |
| Cover Film Color | Yellow/Black |
| PI Thickness | 0.5mil/0.7mil/0.8mil/1mil/2mil |
| Min Finished Size | 5*8mm |
| Min Pad | Inner layer: 5mil Outer layer: 4mil |
| Stiffener Min Size | 4×5mm |
| Stiffener Max Size | 32×32mm |
| Stifferner Alignment Accuracy | ±0.075mm |
| Cover Min openning size | Steeling Tooling: 0.6×0.6mm Precision Tooling: 0.5×0.5mm |
| Min Openning Spacing for Covering Film | Precision tooling: 0.5mm Laser Routing: 0.2mm Normal drilling: 0.15mm |
| Coating Film Overflow Amount（Unilateral） | Normal: 0.08-0.12mm Limitation: 0.03mm |
| Peel-off Strength | 1.4N |
| Planeness | Before baking<15um After baking< 30um |
| Thermal Shock | 288℃ (3 times within 10 seconds) |
| W/B Gold Wire Pull | > 6g |
| Min.Board Thickness | FPCB: 0.1mm/ 4Layers: 0.3mm/ 6Layers: 0.5mm/ 8Layers: 0.6mm/ 10Layers: 0.8mm |
| Inner packing | Vacuum packing, Plastic bag |
| Outer packing | Standard carton packing |
| Standard/ Certificate | ISO9001, ISO14001, IATF 16949, ISO 13485, ROHS,CQC, ANSI/ESD, IPC-A-610, IPC-A-620 |
| Profiling Punching | Routing, V-CUT, Beveling, Chamfer |
