| HDI PCB Technical Specification | |
| Layer | 1-40Layers |
| PCB Material | SY, ITEQ, KB, NOUYA |
| HDI Construction | 1+N+1, 2+N+2, 3+N+3, 4+N+4, 5+N+5, 6+N+6, Anylayer |
| Construction Order | N+N、N+X+N、1+(N+X+N)+1 |
| Min Pattern Width/Spacing | 2mil/2mil |
| Min Mechanical Dirlling Hole | 0.15mm |
| Min Thickness of Core Board | 2mil |
| Laser Dirlling Hole | 0.075mm-0.1mm |
| Min Thickness of PP | 2mil |
| Max Diameter of Resin Plug Hole | 0.4mm |
| Electroplating to Fill Holes Size | 3-5mil |
| Laser Drilling Hole Accuracy | 0.025mm |
| Min BGA Pad Center Distance | 0.3mm |
| Plating Hole-filling Sag | ≤10um |
| Back Drilling/countersink Hole Tolerance | ±0.05mm |
| Through-hole Plating Penetration Capacity | 16:1 |
| Blind Hole Plating Penetration Capacity | 1.2:1 |
| BGA Min PAD | 0.2mil |
| Min Buried Hole(Mechanical Dirlling Hole) | 0.2mil |
| Min Buried Hole(Laser Dirlling Hole) | 0.1mil |
| Min Blind Hole(Laser Dilling Hole) | 0.1mil |
| Min Blind Hole(Mechanical Dilling Hole) | 0.2mil |
| Min Spacing Between Laser Blind Hole and Mechanical Buried Hole | 0.2mil |
| Min Laser Dirlling Hole | 0.10(depth≤55um), 0.13(depth≤100um) |
| Interlaminar Alignment | ±0.05mm(±0.002") |
| Inner Packing | Vacuum packing, Plastic bag |
| Outer Packing | Standard carton packing |
| Standard/ Certificate | ISO9001, ISO14001, IATF 16949, ISO 13485, ROHS,CQC, ANSI/ESD, IPC-A-610, IPC-A-620 |
| Profiling Punching | Routing, V-CUT, Beveling, Chamfer |
