| High Frequency PCB Technical Specification |
| Layer | 1-70 layers |
| Rogers PCB | RO3000 Series: RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RO3210 |
| RO4000 Series: RO4003C, RO4350B, RO4360, RO4533, RO4700, RO4835 |
| RT5000 Series: RT5870, RT5880 |
| RT6000 Series: RT6002, RT6035, RT6006 |
| Arlon PCB | Diclad, Cuclad, Isoclad, AD Series, CLTE eles |
| Taconic PCB | TLX, TLY, RF, TLC, TLG Series, CER10 eles |
| Wanglin Material | F4BK, F4BM, F4B, TP-1/2, TF-1/2, CT330, CT350, CT440, CT615 |
| Finish Copper Thickness | 0.5OZ-12OZ |
| Material Copper Thickness | 0.50z-1OZ |
| Min Finish Board Size | 0.5*1.0mm |
| High Frequerncy Mixed Pressure Layers | 4-70layers |
| Material Mixed Pressure | Rogers/Taconic/Arlon/Wanglin and FR-4 |
| Min Core Thickness | 4mil |
| Max Finish Board Size | RO3000 Series: 590*440mm(Single/Double Side), 580*420mm(Multi-layers) |
| RO4000 Series: 1200*430mm(Single/Double Side), 880*600mm(Multi-layers) |
| RT5000 Series: 590*440mm(Single/Double Side), 580*420mm(Multi-layers) |
| RT6000 Series: 590*440mm(Single/Double Side), 580*420mm(Multi-layers) |
| F4BM Series: 1480*430mm(Single/Double Side) |
| TP/TF Series: 180*180mm(Single/Double Side) |
| CT Series: 1200*430mm(Single/Double Side), 880*600mm(Multi-layers) |
| Max PTFE Array Size(Thicknesss 0.50mm) | 16*18mm |
| Finish Board Thickness | 0.13-8.0mm(Double Side) 0.4-8.0mm(Multi-Layers) |
| Min PTFE Material Dirlling Hole Size | 0.35mm |
| Dielectric Constant(DK) | 1-25 |
| Material Thickness Tolerance | ±0.05mm |
| Finish Board Thickness Tolerance | 1.0mm(±10%) |
| Min Pattern Width Tolerance | ±20um |
| Min Pattern Width/Spacing | 0.076mm |
| Inner Packing | Vacuum packing, Plastic bag |
| Outer Packing | Standard carton packing |
| Standard/ Certificate | ISO9001, ISO14001, IATF 16949, ISO 13485, ROHS,CQC, ANSI/ESD, IPC-A-610, IPC-A-620 |
| Profiling Punching | Routing,V-CUT, Beveling, Chamfer |
