| IC Substrate PCB Technical Specification |
| Layer | 1-16 Layers |
| Min Pattern Size | 25um |
| Min Pattern Space | 25um |
| Min Pad | 80um |
| Min BGA Center Space | 250um |
| Min Thickness/Core/PP Thickness(um) | 2L: 80/30 |
| 4L: 200/50/20 |
| 6L: 240/50/20 |
| 8L: 330/50/20 |
| Solder Mask Color | Green,Black |
| Solder Resis | EG23A, AUS308, AUS320, AUS410 |
| Surface Finish/Treatment | Soft Gold Plating,Hard Gold Plating,ENIG,OSP |
| Flatness(um) | 5max |
| Min. Laser Dirrlled Hole Size(um) | 50 |
| Inner Packing | Vacuum packing, Plastic bag |
| Outer Packing | Standard carton packing |
| Standard/ Certificate | ISO9001, ISO14001, IATF 16949, ISO 13485, ROHS,CQC, ANSI/ESD, IPC-A-610, IPC-A-620 |
| Profiling Punching | Routing, V-CUT, Beveling, Chamfer |
