FPC Assembly

FPC Assembly


1. Features: Thin, flexible, bendable, small in size, and light in weight, with good electrical performance.


2. Applications: Smartphones, tablet PCs, wearable devices, automotive electronics like turn signal, etc.


3. Selling Points: Uses advanced flexible circuit board manufacturing and assembly technologies, adapts to complex spatial structures, and has strict quality control and testing procedures.


4. Processes: Special FPC manufacturing processes such as laser cutting, automatic stiffener machine, hybrid laminator etc. Dedicated soft board assembly technologies like Roll to Roll (R2R).


5. Customization: customization according to customers' design files.

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