IoT PCB Assembly

IoT PCB Assembly


1. Features: Miniaturized, low power consumption, highly integrated, with wireless communication capability.


2. Applications: Smart home, wearable devices, intelligent transportation, and other IoT fields.


3. Selling Points: Uses advanced low-power chips and wireless communication modules, miniaturized design and high-density assembly processes, with good compatibility and expandability.


4. Processes: SMT and micro-packaging technologies, AOI test, FT test, ICT test, BGA technic, selective wave soldering, SMT, DIP, wave soldering, reflow soldering


5. Customization: customization according to customers' design files.


6. ISO 9001:2015+ AS9100D Certified

If you are interested in our products, you can choose to leave your information here, and we will be in touch with you shortly.