PCB Solder Pad Design Standard – Solder Pad Specification Size (Second)

Diode (SMA)
4500-234031-T0
4500-205100-T0

a=1.20±0.30

b=2.60±0.30,c=4.30±0.30

d=1.45±0.20,e=5.2±0.30

Diode (SOD-323)
4500-141482-T0

a=0.30±0.10

b=1.30±0.10,c=1.70±0.10

d=0.30±0.05,e=2.50±0.20

Diodes
(3515)

a=0.30

b=1.50±0.1,c=3.50±0.20

Diodes
(5025)

a=0.55

b=2.50±0.10, c=5.00±0.20

Triode (SOT-523)

a=0.40±0.10,b=0.80±0.05

c=1.60±0.10,d=0.25±0.05

p=1.00

Triode (SOT-23)

a=0.55±0.15,b=1.30±0.10

c=2.90±0.10,d=0.40±0.10

p=1.90±0.10

SOT-25

a=0.60±0.20,b=2.90±0.20

c=1.60±0.20,d=0.45±0.10

p=1.90±0.10

SOT-26

a=0.60±0.20,b=2.90±0.20

c=1.60±0.20,d=0.45±0.10

p=0.95±0.05

SOT-223

a1=1.75±0.25,a2=1.5±0.25

b=6.50±0.20,c=3.50±0.20

d1=0.70±0.1,d2=3.00±0.1

p=2.30±0.05

SOT-89

a1=1.0±0.20,a2=0.6±0.20

b=2.50±0.20,c=4.50±0.20

d1=0.4±0.10,d2=0.5±0.10

d3=1.65±0.20,p=1.5±0.05

TO-252

a1=1.1±0.2,a2=0.9±0.1

b=6.6±0.20,c=6.1±0.20

d1=5.0±0.2,d2=Max1.0

e=9.70±0.70,p=2.30±0.10

TO-263-2

a1=1.30±0.1,a2=2.55±0.25

b=9.97±0.32,c=9.15±0.50

d1=1.3±0.10,d2=0.75±0.24

e=15.25±0.50,p=2.54±0.10

TO-263-3

a1=1.30±0.1,a2=2.55±0.25

b=9.97±0.32,c=9.15±0.50

d1=1.3±0.10,d2=0.75±0.24

e=15.25±0.50,p=2.54±0.10

TO-263-5

a1=1.66±0.1,a2=2.54±0.20

b=10.03±0.15,c=8.40±0.20

d=0.81±0.10,e=15.34±0.2

p=1.70±0.10

SOP
(Pinout(Pitch>0.65mm)

A=a+1.0,B=d+0.1

G=e-2*(0.4+a)

P=p

SOP
(Pitch≦0.65mm)

A=a+0.7,B=d

G=e-2*(0.4+a)

P=p

SOJ
(Pitch≧0.8mm)

A=1.8mm,B=d2+0.10mm

G=g-1.0mm,P=p

QFP
(Pitch≧0.65mm)

A=a+1.0,B=d+0.05

P=p

G1=e1-2*(0.4+a)

G2=e2-2*(0.4+a)

QFP
(Pitch=0.5mm)

A=a+0.9,B=0.25mm

P=p

G1=e1-2*(0.4+a)

G2=e2-2*(0.4+a)