Multilayer Bluetooth PCB
Bluetooth PCB is a circuit board specifically designed to support Bluetooth communication functionality. Based on an insulating substrate (typically FR-4), it is custom-designed according to product size and performance requirements (such as anti-interference and low power consumption). Integrating core components like Bluetooth chips (for signal processing), antennas, resistors, and capacitors, it enables Bluetooth connectivity for devices such as earphones and smart sensors, finishing data transmission and device interconnection.
Specification
Material:FR-4/Rogers RO4350B/RO3003/RO4003/RO3006/RT/Duroid 5880/ RT5870 and Arlon/Isola/Taconic/PTFE F4BM/Teflon material etc.
Layer: 2L 4L6L8L 10L 12L 14L 16L18L20L22L24L26L28L30L
Dielectric Constant (DK):2.20/2.55/3.00/3.38/3.48/3.50/3.6/6.15/10.2
Application
Consumer Electronics /Military/Space/ Antenna & Communications System/ High Power /Medical/ Automotive/Industrial / Handheld device cellular /Wifi Antenna/ Telematics and infotainment /Wif/Computing/Radar/Power Amplifiers
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Managing kitting and packaging in-house can be time-consuming, costly, and error-prone.
Maybe an off-the-shelf cable can't meet your needs.
Twisting entwines multiple wires and arranges them tightly next to each other. Depending on the AWG size, we can group up to fifty conductors.
Shielding refers to the metallic layer surrounding a cable’s conductor, created to limit signal interference between the wire and external fields.
PCB manufacturing is the process of building a physical PCB from a PCB design according to a certain set of specifications.
The following design standards refer to the IPC-SM-782A standard and the design of some famous Japanese design manufacturers and some better design solutions accumulated in the manufacturing experience.
Via holes, also known as through holes, play a role in connecting different parts of a circuit board.
