High-Density Interconnect (HDI) Printed Circuit boards are multilayer boards with high-density wiring per unit area.
Model :6L(1+N+1)
Material:FR-4 ITEQ IT180A
Layer : 6L1+N+1 HDI
Model:10 L(1+8+1)
Layers:10
Material: SY
Finished Thickness:1.2mm
Copper Thickness:0.5OZ
WiFi module, also called a serial port Wi-Fi module, falls under the IoT transmission layer.
The layer count is determined by signal density and complexity. Typically, 8–12 layers are used, with cores and outer layers connected via blind and buried vias.
