Features of PCBs

Features of PCBs

Blue Peelable Printed Circuit Boards
Blue Peelable Printed Circuit Boards

A peelable solder mask is a temporary protective coating applied to specific areas of a PCB during the manufacturing process. 

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Hybrid Microwave PCB
Hybrid Microwave PCB

Hybrid microwave PCB is using a dissimilar materials with the intent of optimizing electrical performance and improving system reliability focused towards high-frequency RF applications. 


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RF PCB
RF PCB

RF PCBs are circuit boards specifically designed to handle high-frequency and radio frequency signals. 

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RF/Microwave PCBs
RF/Microwave PCBs

We can reduce the multilayer PCB board size with the help of inner layers as per PCB design rules.


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Metal-Core Printed Circuit Boards (MCPCBs)
Metal-Core Printed Circuit Boards (MCPCBs)

MCPCBs, also known as insulated metal substrate (IMS) PCBs or thermal clad PCBs.

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Double Layer Aluminum PCB
Double Layer Aluminum PCB

Double-sided aluminum substrates are widely used in electronics manufacturing. 

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Single-Layer Aluminum PCB
Single-Layer Aluminum PCB

This PCB consists of a single layer of aluminum substrate PCB, they are comparatively simple in design and used in applications where heat management is the main concern.

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MC PCB Aluminum PCB
MC PCB Aluminum PCB

Aluminum PCB, also known as metal core PCB or aluminum core PCB, is a circuit board with aluminum substrate. 

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6L HDI Portable Electron PCB
6L HDI Portable Electron PCB

Model :6L(1+N+1)

Material:FR-4 ITEQ IT180A

Layer : 6L1+N+1 HDI

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10 L HDI Communication PCB
10 L HDI Communication PCB

Model:10 L(1+8+1)

Layers:10

Material: SY

Finished Thickness:1.2mm

Copper Thickness:0.5OZ

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High-Quality Rigid PCBs
High-Quality Rigid PCBs

Higher Functionality: Rigid PCB boards allow multiple-layer construction and connection density, it has higher functionality and flexibility in board design.

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4L 1+N+1 HDI Half Hole Wifi Module PCB
4L 1+N+1 HDI Half Hole Wifi Module PCB

WiFi module, also called a serial port Wi-Fi module, falls under the IoT transmission layer. 

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Mobile Phone HDI PCB
Mobile Phone HDI PCB

The layer count is determined by signal density and complexity. Typically, 8–12 layers are used, with cores and outer layers connected via blind and buried vias.


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